Laird, as an industry leader in high-performance, cost-effective Thermal Interface Materials (TIMs) and technologies, designs and manufactures thermal products; including gap fillers and putties, phase change materials, thermal grease, and thermally conductive insulator materials that meet the demands of any application.
Today’s electronics are smaller and more powerful than ever before, leading to increased thermal challenges for the systems designer. While fans, heat sinks, thermoelectric devices, and even liquid cooling can be used to provide enough cooling power, the problem remains transferring the heat from the hot components into the cooling hardware. TIMs are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Laird is the world leader in material development for TIMs and offers the broadest line of products to meet every design challenge.
Laird dispensable gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly when elimination of mechanical stress or bulk automated dispensing are critical design considerations. These materials can be dispensed to fill large and uneven gaps in assemblies due to their super compliant nature; little to no pressure is transferred between interfaces. Laird’s dispensing product portfolio includes both one and two-part materials, as well as products specifically designed for vertical stability and consistent dispensing.
High-performance products are used in applications where mechanical tolerances and general design has been optimized for thermal performance.
The Tpcm phase change product line is used in applications where reliability, repeatability, and handling must be controlled to optimize the performance as part of the total thermal solution. The Tpcm product line is available in a screen printable formulation that offers the reliability and performance of a phase change material with the low-cost handling of thermal grease.
Tgrease is used in applications where a minimum bond line, constant pressure, and ease of screen printing are desired for optimal performance. Laird’s high-performance Tgrease products are designed to maximize reliability by eliminating pump out in most applications.
Laird gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. Laird’s extensive gap filler product lines includes a wide range of performance capabilities, including ultra-thin gap fillers, a high deflection series, and materials that provide electrical isolation.
We offer automation solutions for all forms of Thermal Interface Materials (TIMs): dispensable gap fillers, printed thin gap TIMs (TIM Print™), “robotic motion control” placed thick-gap TIMs (TIM Pick™). Where dispensable gap fillers cannot meet your needs, we can now automate Laird Performance Materials’ (LPM’s) thermal pad product offerings at competitive or eve lower costs to that of dispensable TIMs.
We are a leader in TIMs. Now we are a leader in TIM automation solutions: One of the only firms offering an automated solution for all forms of TIMs.
Watch videos of Laird's TIM automation solutions in action here.
Tgard thermally conductive electrical insulators are used where electrical isolation is a critical design consideration, along with reliability, cut-through resistance, and thermal conductivity. The Tgard product line has a wide variety of materials for the unique performance, handling, and assembly considerations required in electronics devices.
Tlam thermally conductive circuit boards are designed with Laird’s unique dielectric materials 1KA and HTD. Tlam technology improves thermal performance while retaining good dielectric isolation.
The 1KA materials offers high thermal conductivity for applications where a thick dielectric is required. The 1KA material is available as a freestanding Tpreg to facilitate multilayer and FR4 hybrid circuit boards.
The HTD material is used where high withstand voltage (>500 VDC) and continuous use temperature of 150°C are required.