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Tpcm HP105

Thermal Phase Change Material



Product Description


For Exceptionally Low Thermal Resistance The Tpcm™ HP105 Series is a high-performance phase change material (PCM) product with exceptionally low thermal resistance. It has a softening range of approximately 50deg C to 60deg C. Proprietary technology prevents excessive pump-out after the initial heat cycle. The material is naturally tacky and requires no adhesive coating or heat sink preheat for attachment. The Tpcm HP105 Series does not cure and can be easily removed without pulling the processor out of the socket. It is supplied in rolls with a top tabbed liner for easy manual or large volume automated applications.



Industries
ConsumerTelecom/Datacom

Capabilities
Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development
ModelingPrototyping
ServiceTesting

Applications
Graphic CardsHard Disk Drives
IGBTsMemory Modules
Notebooks/Tablets/Portable DevicesServers
Smart Home DevicesWireless infrastructure

Technical Specification

ColorWhite
Density (g/cc)1.30
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-25
Phase Change Temperature (Deg C)50
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)0.73
Thermal Resistance @50 psi Max (C-in2/W)0.017
Thermal Resistance @50 psi Min (C-in2/W)0.017
Thickness Max (inches)0.005
Thickness Max (mm)0.13
Thickness Min (inches)0.005
Thickness Min (mm)0.13
Volume Resistivity3.00 x10^14 Ohm-cm
Parts (2)
↑ click on headings to sort ↓
Part NumberPart NameThickness(inches)Thermal Resistance @ 50 psi(C - in2 / W)
A13423-01Tpcm HP105 9x9in0.0050.02
A13423-02Tpcm HP105 18x18in0.0050.02

Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


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