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Slim TIM 10000

Ultra-thin Thermal Gap Filler



Product Description


Slim TIM 10000 utilizes a unique polymer chosen to maximize system performance. The specially designed polymer package: enables free standing, thin films (no carrier film, e.g., PI, fiberglass) which minimizes contact thermal resistance. Slim TIM has been shown to survives multiple solder reflow operations (Pb-free solder reflow profiles) and also allows for easy rework, requiring minimal force to separate components.


Features and Benefits
  • Free standing film
  • High thermal performance
  • Exceptionally low thermal resistance
  • Silicone-free
  • Solder reflow compatible (3X)
  • High reliability
  • Easy rework
  • Naturally tacky (no PSA needed)

Industries
Aerospace/DefenseAutomotive
ConsumerIndustrial
Telecom/Datacom

Capabilities
Automated PackagingAutomated Pad Placement
Custom AutomationCustom Product Development
ModelingPrototyping
ServiceTesting

Applications
Automotive ADASAutomotive Electronics
Automotive InfotainmentAutomotive Powertrain/ECUs
Drones/SatellitesGaming Systems
InstrumentationNotebooks/Tablets/Portable Devices
RoutersSmart Home Devices
Wireless infrastructure

Technical Specification

ColorGrey
Density (g/cc)2.50
Hardness (Shore 00)80
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-50
Shelf Life1 year from Date of Shipment
Thermal Conductivity (W/mK)5.50
UL Flammability RatingV-0
Documents



Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


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