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SIL35-HXP

Form-in-Place Gasket



Product Description


Laird’s Form-In-Place is an automated system for dispensing non-conductive and conductive elastomer EMI shielding and grounding gaskets onto metal substrates. This product is particularly ideal for base stations, PDAs, PC cards, radios, and mobile phones, as well as many other cast enclosures and packaged electronic assemblies.


Features and Benefits
  • Form-in-place gasketing offers a total cost savings in the form of reduced raw materials, labor or assembly time
  • Room temperature cure gasketing materials eliminate the need for costly heat curing systems, allowing the use of inexpensive plastic or metal substrates
  • Single-component compounds eliminate the need for mixing ingredients, thereby shortening production cycles and eliminating related waste
  • Easy to program operating system allows for quick part-to-part changeover, minimal tooling investment for new designs, and prototype development in 24 to 48 hours
  • High shielding effectiveness: 85–100 dB up to 10 GHz

Industries
5G Data Infrastructure5G Telecom
AutomotiveAutomotive and Industrial Electronics
Autonomous VehicleCloud
DatacomHealthcare / Medical
IndustrialNetwork and telecommunications equipment
RailTelecom, 5G, Consumer, Automotive, Military
Telecom, Automotive, OtherTest & Measure
Wireless

Capabilities
Automated PackagingCustom Automation
Custom Product DevelopmentPrototyping
ServiceTesting

Applications
IT cabinetsRadar
Remote radio unitsTelecom cabinets
Wireless infrastructure

Technical Specification

ColorTransprarent
Compression Set<20
Filler TypeNon-conductive
Gasket ProfileD-Shape
Hardness35
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-50
Resin TypeSilicone



Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS


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