Solutions: Gap Fillers


Softzorb MCS


Home - Products - Absorbers - Microwave Absorbing Gap Fillers

Low deflection force absorber gap filler

This softer material offers lower deflection for use in cavities whenever a lid may potential contact with and compress the absorber causing possible damage to other components. In addition, Softzorb MCS’ ability to more thoroughly fill the cavity greatly increases absorber performance by limiting leakage around the absorber. Can be used in commercial Datacom equipment such as optical transceiver cavities where space is at a premium and superior absorbing capabilities are required

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Tputty 508


Home - Products - Thermal Interface Materials - Dispensable Gap Fillers

One Part Liquid Dispensable Gap Filler

Laird Tputty 508 is a single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations. Tputty 508 is ideal for applications that can benefit from automation, and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty™ 508 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. Combined with Laird’s global technical support and global footprint, deploying Tputty™ 508 is easier than ever. When it is time to integrate Tputty 508 into your production environment Laird can work with your existing dispensing partner or provide recommendations for a dispensing equipment provider.

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Tputty 607


Home - Products - Thermal Interface Materials - Dispensable Gap Fillers

One Part Liquid Dispensable Gap Filler

Laird Tputty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations. Tputty 607 is ideal for applications that can benefit from automation; and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty 607 will exert minimal stress on your component while maintaining interface contact to maximize thermal transfer. Combined with Laird’s global technical support and global footprint, deploying Tputty 607 is easier than ever.

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Tputty 403


Home - Products - Thermal Interface Materials - Dispensable Gap Fillers

One Part Liquid Dispensable Gap Filler

Tputty 403 is a single-part silicone-based thermal gap filler that is soft and low abrasion. Tputty 403 is ideal for applications where large or uneven gap tolerances are present. The soft and compliant nature of this material allows for the transfer of little to no pressure on mating parts. Tputty 403 provides excellent thermal performance and compliance.

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Tflex CR350


Home - Products - Thermal Interface Materials - Dispensable Gap Fillers

Two Part Liquid Dispensable Gap Filler

Tflex™ CR350 is a soft, compliant, high thermal conductivity, two-part dispensable gap filler providing a low thermal resistance and high reliability. This dispensable gap filler minimizes stress on components during assembly while providing the reliability of a traditional thermal pad. Tflex™ CR350 is ideal for application where large gap tolerances are present, meeting vertical shock and vibe requirements, typical of the automotive industry. The 1:1 mix is easily dispensable through a wide variety of off the shelve dispensing equipment. It is an A+B putty material that cures in place after dispensing and mixing to perfectly fill the gap. The experts at Laird can help design the system that is right for you

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Tgon 800



Electrically Condutive Graphite Gap Filler

Used where electrical isolation is not required, Tgon 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.

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Tflex P300



Polyimide lined Gap Filler

Laird Tflex® P300 is a soft and compliant gap filler with an integrated polyimide liner. Laird has leveraged its vast experience and knowledge in the development of thermally conductive materials to develop a soft and compliant gap filler that minimizes contact resistance and board level stresses. In conjunction with these key traits Laird understands that not all applications are the same. As a result, Tflex P300 comes with a unique and integrated polyimide film on one side. This liner provides numerous application benefits like electrical isolation, placement ease during assembly, and tear resistance for applications that require shear.

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Tflex 50000



Silicone based Thermal Gap Filler

Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 50000 is a compliant elastomer gap filler designed to provide excellent thermalperformance while remaining cost effective. This soft interface pad conforms well withminimal pressure, resulting in little or no stress on mating parts. Tflex 50000's uniquesilicone and filler combination has extremely low silicone extractables compared to manyother silicone interface products. Tflex 50000 meets NASA outgassing specification. Tflex 50000 is naturally tacky, no adhesive coating is required. Tflex 50000 is electricallyinsulating, stable from -50ºC to 200ºC and is certified to UL 94V0 flammability rating.

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Tputty 502



Silicone based Thermal Gap Filler

Creates Compression Of Interface Material Tputty 502 is the best material for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness. Tputty 502 will flow and ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty 502 has a high thermal conductivity, resulting in very low thermal resistance. Tputty 502 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Bulk: Tputty 502 is available in bulk form in the following sizes: 100 cc Jar 500 cc Jar 1000 cc Jar Consult the factory for alternate bulk sizes. Standard Sheet Sizes 9 x 9 (229mm x 229mm) and 18 x 18 (457mm x 457mm). 9 x 9 only over 0.100 thickness Tputty 502 is available in individual die cut shapes. Pressure sensitive adhesive is not applicable for Tputty products. Reinforcement Tputty 502 sheets are reinforced on both sides with fiberglass. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

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Tflex 600



Silicone based Thermal Gap Filler

EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER Tflex 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is stable from -45°C to 200°C and meets UL 94 V0 rating. STANDARD THICKNESSES 0.020 to 0.200-inch (0.5 to 5.0mm) 0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments Inquire about availability of material and options above 0.200-inches STANDARD SHEET SIZES 9 x 9 inch (229 x 229mm). 18 x 18 inch (457 x 457mm). 9 x 9 inch only over 0.100 inch thickness. TflexTM 600 can be die cut to individual shapes. Pressure sensitive adhesive is not applicable for TflexTM 600 products. TACKY ONE SIDE ONLY Tflex 600 is naturally tacky on both sides. Tflex 600 can be provided tacky on one side only. This is indicated by the suffix DC. This option offers good separation properties allowing the tacky side to stick to the heatsink/chasis/cold plate/etc. and the other dry side to release easily from the component(s). REINFORCEMENT Fiberglass is required in 0.020 inch (0.51mm) and 0.030 inch (0.76mm). Thicknesses of 0.040 inch (1.02mm) and above do not require reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

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Tflex HD300



Silicone based Thermal Gap Filler

Laird Tflex HD300 is a 2.7 W/mK gap filling material in our high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird's unique manufacturing capabilities, filler and resin knowledge result in this unique product designed with customer applications in mind. Tflex HD300 is provided in thickness from .5mm (.020"") up to 5mm (.200"") in .5mm (.020"") increments as standard. Non-standard increments of .25mm (.010"") are available if required, please contact Laird for information and pricing. In addition, Laird can provide Tflex HD300 in multiple converted formats through approved converters and distribution networks. Also, if your application requires, we can deliver sheets of material as large as 460mm (18"") X 460mm (18"").

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Tflex HR400



Silicone based Thermal Gap Filler

MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography resulting in little stress on the components mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock resulting in improved device reliability. Tflex HR400's recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. Tflex HR400 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. Tflex HR400 is electrically insulating stable from -50?C thru 160?C and meets UL 94V0 flame rating. STANDARD THICKNESSES Standard thickness is 0.020-inch (0.5 mm) through 0.400-inch (10.2 mm) and available in 0.010-inch increments. Please contact Laird Technologies for availability of thicknesses above 0.200-inch. OPTIONS Fiberglass is standard in 0.020-inch and 0.030-inch thicknesses to aid in handling and is designated by the suffix œ-FG. Material is standard with both sides tacky; the -DC1 suffix indicates only one side is tacky. MATERIAL NAME AND THICKNESS Tflex indicates Laird Technologies™ elastomeric thermal gap filler product line. HR4XXX indicates Tflex HR400 product line with thickness in mils (0.001-inches); -DC1 indicates only one side tacky; -FG indicates fiberglass reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

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Tflex HR600



Silicone based Thermal Gap Filler

Mid-Performance Gap Filler with 3 W/mKTflex HR600 is a cost-effective and compliant gap filler thermal interface material withexcellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stresson the components, mating chassis or parts. The softness relieves mechanical stress fromhigh stack-up tolerance and absorbs shock, resulting in improved device reliability. TflexHR600™s recovery properties for applications requiring material rework result in continuedmechanical integrity even after device rework and re-assembly. Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating toinhibit thermal performance. The tack is designed to hold the pad in place duringassembly and component transport. Tflex HR600 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0flame rating. Standard Thicknesses 0.010-inch to 0.200-inch (0.25 to 5.0 mm) 0.010-inch and 0.015-inch thick materials come standard with fiberglass reinforcement designated by the suffix œFG Options Proprietary DC1 option available to eliminate tack from one side to aid in handling. Material Name and Thickness Tflex indicates elastomeric gap filler product line HR6xxx indicates high recovery ˜6 series™ 3 W/mK material FG desginates Fiberglass (available in 0.010 and 0.015-inch thickness only) DC1 designates proprietary option eliminating tack from one side Examples Tflex HR6120 = 0.120-inch thick material Tflex HR610FG = 0.010-inch thick material with fiberglass reinforecement Tflex HR6120-DC1 = 0.120-inch thick material with proprietary DC1 option

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Tflex 300



Silicone based Thermal Gap Filler

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancingthermal transfer. The material has a very low compression set enabling the pad to be reusedmany times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at lowpressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improvedrework. The metallized liner lower coefficient of friction also allows for easy assembly ofparts that must slide together, such as a card into a chassis.

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Tflex 700



Silicone based Thermal Gap Filler

Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance. STANDARD THICKNESSES Standard thickness 0.020"" (0.5mm) through 0.200"" (5.0mm) available in 0.010"" (0.25mm) increments. MATERIAL NAME AND THICKNESS Tflex - indicates elastomeric gap filler product line. 7XXX - indicates Tflex 700 product line and thickness in mils (0.001-inches). -DC1 - one side tacky; default is both sides tacky. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

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Tflex B200



Silicone based Thermal Gap Filler

Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easier handling and features a range of multiple surface and enforcement options for a variety of applications. This gap filler™s low modulus interface and softness relieves mechanical stress. It properly fills gaps, with tolerance to reduce thermal resistance. Tflex B200 helps absorb shock, resulting in improved device reliability over the long term. It has high dielectric insulation which works to protect against dielectric breakdown in or between devices. Tflex B200 as a standard product is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and transport. Tflex B200MFG, an option featuring fiberglass in the middle, has strong tensile and both sides exhibit tackiness properties. This helps prevent deforming during manual or automated assembly. Tflex B200FG, a second option, has fiberglass enforcement located near one side. It offers a side difference, a higher deflection than the B200MFG option, and provides protection close to one side.

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Tflex HD700



Silicone based Thermal Gap Filler

Tflex HD700 combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD700 is available in thickness from 0.5mm (0.020"") to 5mm (0.200""). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.

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Tflex HD80000



Silicone based Thermal Gap Filler

Tflex HD80000 combines 6.0 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.

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Tflex HD90000



Silicone based Thermal Gap Filler

Tflex HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD90000 is available in thickness from 0.040"" (1000 µm) to 0.200"" (5000 µm). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.

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Tflex 300TG



Silicone based Thermal Gap Filler

The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production.

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Tpli 200



Silicone based Thermal Gap Filler

Tpli 200 is an Exceptionally Soft, Highly Compressible Gap Fillerpremium gap filler. Tpli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli 200 is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating

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Tflex SF600



Silicone Free Thermal Gap Filler

Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high performance silicone-free thermal gap filler with a conductivity of 3.0 W/mK. Tflex SF600 is designed for applications which are silicone sensitive. RoHS compliant. Standard Thickness Standard thickness is 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) and available in 0.010-inch (0.25 mm) increments. 0.010-inch is only available in custom cut parts (sheet material is not available). MATERIAL NAME AND THICKNESS Tflex indicates Laird Technologies™ brand thermally conductive elastomeric gap filler product. SF6xx indicates ˜SF600 series™ 3.0 W/mK material and xxx indicates thickness in mils (0.001-inches) Examples: Tflex SF620 = 0.020-inch thick material

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Tflex SF800



Silicone Free Thermal Gap Filler

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive. Tflex SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly. STANDARD THICKNESSES Standard thickness is 0.020-inch (0.50 mm) through 0.16-inch (4.064mm) in 0.010-inch increments MATERIAL NAME AND THICKNESS Tflex indicates Laird Technologies™ gap filler product line. SF8XXX indicates Tflex SF800 product line with thickness in mils (0.001-inches). EXAMPLES: Tflex SF840 = standard 0.040-inch thick Tflex SF800 material. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

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Tflex P100



Tgard lined Gap Filler

Laird Tflex P100 is a soft and compliant gap filler with an integrated Tgard liner and adds a complementing performance level to the P series product line from Laird. Laird has leveraged its vast experience and knowledge in the development of thermally conductive materials to develop a soft and compliant gap filler that minimizes contact resistance and board level stresses. In conjunction with these key traits Laird understands that not all applications are the same. As a result, Tflex P100 comes with a unique Tgard liner on one side. This liner provides numerous application benefits like electrical isolation, placement ease during assembly, tear resistance for applications that require shear, to name a few. Tflex P100 will be offered in thicknesses that range from .5mm (.020”) up to 5mm (.200”).

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Slim TIM 10000



Ultra-thin Thermal Gap Filler

Slim TIM 10000 utilizes a unique polymer chosen to maximize system performance. The specially designed polymer package: enables free standing, thin films (no carrier film, e.g., PI, fiberglass) which minimizes contact thermal resistance. Slim TIM has been shown to survives multiple solder reflow operations (Pb-free solder reflow profiles) and also allows for easy rework, requiring minimal force to separate components.

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Tflex UT20000



Ultra-thin Thermal Gap Filler

Ultra-thin gap filler offering great thermal performance and handling. Tflex UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly. The elastomeric property of Tflex UT20000 provides excellent interfacing and wetting out mating surfaces in thin interface where efficiently transfer heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements. Tflex UT20000 is electrically non-conductive, stable from -40°C thru 200°C and offered in thicknesses that range from 0.008 inches (0.2mm) up to 0.040 inches (1.0mm).

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